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LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
BAR DIGIT LED DISPLAY
CUSTOMER DESIGN
Pb
Lead-Free Parts
LBD1B2B-XX/RP3-PF
DATA SHEET
DOC. NO REV. DATE
: :
QW0905- LBD1B2B-XX/RP3-PF A
: 06 - May.- 2006
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LBD1B2B-XX/RP3-PF Page 1/11
Package Dimensions
45.5(1.791") 4.9X8=39.2(1.543") 6.0 (0.236")
E
7.7 (0.303") 5.5 (0.217") O0.45 TYP
E
E
R
E
Y
G
Y
G
4.0 (0.157") 4.0 (0.157") 3.00.5 2.0 (0.079")
1.5 (0.059")
2.54X10=25.4 (1.0") 5.20.5
PIN NO.1 LBD1B2B-XX/RP3-PF LIGITEK
Note : 1.All dimension are in millimeters and (lnch) tolerance is 0.25mm unless otherwise noted. 2.Specifications are subject to change without notice.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LBD1B2B-XX/RP3-PF Page 2/11
Internal Circuit Diagram
LBD1B2B-XX/RP3-PF
1, 11
HE
HE HE HRF HE HYS UG HYS UG
2 3 4 5 6 7 8 9 10
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LBD1B2B-XX/RP3-PF Page 3/11
Electrical Connection
PIN NO.1
1 2 3 4 5 6
LBD1B2B-XX/RP3-PF
Common Anode Cathode Orange Cathode Orange Cathode Orange Cathode Red Cathode Orange Cathode Yellow
7 8 9 10 11
Cathode Green Cathode Yellow Cathode Green Common Anode
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LBD1B2B-XX/RP3-PF Page 4/11
Absolute Maximum Ratings at Ta=25
Ratings Parameter Symbol HE Forward Current Per Chip Peak Forward Current PerChip (Duty 1/10,0.1ms Pulse Width) Power Dissipation Per Chip Reverse Current Per Any Chip Electrostatic Discharge Operating Temperature Storage Temperature IF 30 HRF 30 HYS 30 UG 30 mA UNIT
IFP
60
90
60
120
mA
PD Ir ESD Topr Tstg
75
75 10 2000
75
100
mW
A A
-40 ~ +85 -40 ~ +85
Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260
Part Selection And Application Information(Ratings at 25)
Electrical
PART NO
common cathode Material Emitted or anode
CHIP
AlGaInP Orange AlGaInP Red
D (nm)
620 630
(nm)
17 20 15 20 1.7 1.5 1.7 1.7
Vf(v)
Iv(mcd)
IV-M
Min. Typ. Max. Min. Typ. 2.1 1.8 2.1 2.1 2.6 2.4 2.6 2.6 10.5 21.5 21.5 21.5 10.5 35 35 18 2:1 2:1 2:1 2:1
LBD1B2B-XX/RP3-PF AlGaInP Yellow AlGaInP Green
Common Anode
587 574
Note : 1.The forward voltage data did not including 0.1V testing tolerance. 2. The luminous intensity data did not including 15% testing tolerance.
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LBD1B2B-XX/RP3-PF Page 5/11
Test Condition For Each Parameter
Parameter Forward Voltage Per Chip Luminous Intensity Per Chip Dominant Wavelength Spectral Line Half-Width Reverse Current Any Chip Luminous Intensity Matching Ratio
Symbol Vf Iv
Unit volt mcd nm nm
Test Condition If=20mA If=10mA If=20mA If=20mA Vr=5V
D
Ir IV-M
A
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LBD1B2B-XX/RP3-PF Page 6/11
Typical Electro-Optical Characteristics Curve
HE CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
1000
3.5
Forward Current(mA)
100
Relative Intensity Normalize @20mA
1.0 1.5 2.0 2.5 3.0
3.0 2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000
10
1.0 0.1
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
1.2
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
2.0
Forward Voltage@20mA Normalize @25
Relative Intensity@20mA Normalize @25
-40 -20 0 20 40 60 80 100
1.1
1.5
1.0
1.0
0.9
0.5
0.8
0.0 -40 -20 0 20 40 60 80 100
Ambient Temperature()
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength
1.0
Relative Intensity@20mA
0.5
0.0 550 600 650 700
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LBD1B2B-XX/RP3-PF Page 7/11
Typical Electro-Optical Characteristics Curve
HRF CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
1000
3.5
Forward Current(mA)
100
Relative Intensity Normalize @20mA
1.0 1.5 2.0 2.5 3.0
3.0 2.5 2.0 1.5 1.0 0.5 0 1.0 10 100 1000
10 1.0
0.1
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
1.2
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0
Forward Voltage@20mA Normalize @25
Relative Intensity@20mA Normalize@25
-40 -20 -0 20 40 60 80 100
2.5 2.0 1.5 1.0 0.5 0 -40 -20 -0 20 40 60 80 100
1.1
1.0
0.9 0.8
Ambient Temperature()
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength
Relative Intensity@20mA
1.0
0.5
0 550 600 650 700
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LBD1B2B-XX/RP3-PF Page8/11
Typical Electro-Optical Characteristics Curve
HYS CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
1000
3.0
Forward Current(mA)
100
Relative Intensity Normalize @20mA
1.0 1.5 2.0 2.5 3.0
2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000
10
1.0 0.1
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
1.2
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0
Forward Voltage@20mA Normalize @25
Relative Intensity@20mA Normalize @25
1.1
2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.0
0.9
0.8 -40 -20 0 20 40 60 80 100
Ambient Temperature()
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength
1.0
Relative Intensity@20mA
0.5
0.0 500 550 600 650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LBD1B2B-XX/RP3-PF Page 9/11
Typical Electro-Optical Characteristics Curve
UG CHIP
Fig.1 Forward current vs. Forward Voltage Fig.2 Relative Intensity vs. Forward Current
1000
3.0
Forward Current(mA)
100 10
Relative Intensity Normalize @20mA
1.0 2.0 3.0 4.0 5.0
2.5 2.0 1.5 1.0 0.5 0.0 1.0 10 100 1000
1.0 0.1
Forward Voltage(V) Fig.3 Forward Voltage vs. Temperature
1.2
Forward Current(mA) Fig.4 Relative Intensity vs. Temperature
3.0
Forward Voltage@20mA Normalize @25
Relative Intensity@20mA Normalize @25
60 80 100
2.5 2.0 1.5 1.0 0.5 0.0 -40 -20 0 20 40 60 80 100
1.1
1.0
0.9
0.8 -40 -20 0 20 40
Ambient Temperature()
Ambient Temperature()
Fig.5 Relative Intensity vs. Wavelength
1.0
Relative Intensity@20mA
0.5
0.0 500 550 600 650
Wavelength (nm)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LBD1B2B-XX/RP3-PF Page 10/11
Soldering Condition(Pb-Free) 1.Iron: Soldering Iron:30W Max Temperature 350 C Max Soldering Time:3 Seconds Max(One Time) Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 C 2.Wave Soldering Profile Dip Soldering Preheat: 120 C Max Preheat time: 60seconds Max Ramp-up 2C/sec(max) Ramp-Down:-5 C/sec(max) Solder Bath:260 C Max Dipping Time:3 seconds Max Distance:Solder Temperature 1/16 Inch Below Seating Plane For 3 Seconds At 260 C
Temp(C) 260 C3sec Max
260
5 /sec max
120
2 /sec max Preheat
60 Seconds Max
25 0 0
50
100
150
Time(sec)
LIGITEK ELECTRONICS CO.,LTD. Property of Ligitek Only
PART NO. LBD1B2B-XX/RP3-PF Page 11/11
Reliability Test:
Test Item
Test Condition
1.Under Room Temperature 2.If=10mA 3.t=1000 hrs (-24hrs, +72hrs)
Description
This test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed.
Reference Standard
MIL-STD-750: 1026 MIL-STD-883: 1005 JIS C 7021: B-1
Operating Life Test
High Temperature Storage Test
1.Ta=105 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of high temperature for hours.
MIL-STD-883:1008 JIS C 7021: B-10
Low Temperature Storage Test
1.Ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs)
The purpose of this is the resistance of the device which is laid under condition of low temperature for hours.
JIS C 7021: B-12
High Temperature High Humidity Test
1.Ta=65 5 2.RH=90 %~95% 3.t=240hrs 2hrs
The purpose of this test is the resistance of the device under tropical for hours.
MIL-STD-202:103B JIS C 7021: B-11
Thermal Shock Test
1.Ta=105 5&-405 (10min) (10min) 2.total 10 cycles
The purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. This test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire.
MIL-STD-202: 107D MIL-STD-750: 1051 MIL-STD-883: 1011
Solder Resistance Test
1.T.Sol=260 5 2.Dwell time= 10 1sec.
MIL-STD-202: 210A MIL-STD-750: 2031 JIS C 7021: A-1
Solderability Test
1.T.Sol=230 5 2.Dwell time=5 1sec
This test intended to see soldering well performed or not.
MIL-STD-202: 208D MIL-STD-750: 2026 MIL-STD-883: 2003 JIS C 7021: A-2

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